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Agency Recognition for Telecommunications and Networking Devices
UL
CSA
File # E74889
File #78165C
TüV
Per IEC60730-1
Certificate # for individual products available upon request.
Table T7
Recommended Pad Layouts for Surface-mount Telecommunications and Networking
Devices in millimeters (inches) Nominal
Device
TS250 (All)
TSV250 (All)
TSL250 (All)
TS600 (All)
TSM600 (All)
A
4.60
(0.180)
2.29
(0.090)
3.60
(0.140)
10.42
(0.410)
5.20
(0.205)
B
1.80
(0.070)
2.41
(0.095)
1.80
(0.070)
3.30
(0.130)
17.80
(0.701)
C
6.10
(0.240)
6.35
(0.250)
5.50
(0.220)
3.35
(0.132)
5.54
(0.218)
D
—
—
3.43
(0.135)
—
—
—
—
6.75
(0.266)
E
—
—
—
—
—
—
—
—
2.08
(0.082)
F
—
—
—
—
—
—
—
—
3.12
(0.123)
G
—
—
—
—
—
—
—
—
8.39
(0.331)
Figure
T18
T19
T18
T18
T20
Figure T18
Figure T19
Figure T20
B
A
A
B
B
A
D
A
E G
F
B
C
B
C
C
D
Solder Reflow and Rework Recommendations for Telecommunications Surface-mount Devices
Profile Feature
Pb-Free Assembly
Figure T21
Average ramp up rate (Ts MAX to Tp)
Preheat
? Temperature min. (Ts MIN )
? Temperature max. (Ts MAX )
? Time (ts MIN to ts MAX )
3°C/second max.
150°C
200°C
60-180 seconds
Tp
T L
Ts MAX
Ramp up
tp
t L
Critical Zone
T L to Tp
Time maintained above:
? Temperature (T L )
217°C
Ts MIN
? Time (t L )
Peak/Classification temperature (Tp)
60-150 seconds
260°C
ts
Preheat
Ramp down
12
Time within 5°C of actual peak temperature
Time (tp)
Ramp down rate
20-40 seconds
6°C/second max.
25
Reflow Profile
t 25?C to Peak
Time
Time 25°C to peak temperature
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package
body surface.
Solder Reflow
? Recommended reflow method: IR, vapor phase oven, hot air oven.
? Surface-mount devices are not designed to be wave soldered to the bottom side of the board.
? Recommended maximum paste thickness of 0.25mm (0.010 in).
? Devices can be cleaned using standard industry methods and solvents.
Rework
? If a device is removed from the board, it should be discarded and replaced with a new device.
228
RoHS compliant, ELV compliant
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